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| (R) STPS2045C POWER SCHOTTKY RECTIFIER Table 1: Main Product Characteristics IF(AV) VRRM Tj (max) VF (typ) FEATURES AND BENEFITS 2 x 10 A 45 V 175C 0.57 V A1 K A2 Very small conduction losses Negligible switching losses Extremely fast switching Insulated package: TO-220FPAB Insulating voltage = 2000V DC Capacitance = 12 pF Avalanche rated A2 A1 K A1 K A2 TO-220AB STPS2045CT I2PAK STPS2045CR DESCRIPTION Dual center tap Schottky rectifier suited for SwitchMode Power Supply and high frequency DC to DC converters. Packaged either in TO-220AB, TO-220FPAB, I2PAK, or D2PAK, this device is especially intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. K K A1 A2 A1 A2 TO-220FPAB STPS2045CFP D2PAK STPS2045CG Table 2: Order Codes Part Number STPS2045CT STPS2045CFP STPS2045CG STPS2045CG-TR STPS2045CR Marking STPS2045CT STPS2045CFP STPS2045CG STPS2045CG STPS2045CR November 2004 REV. 5 1/8 STPS2045C Table 3: Absolute Ratings (limiting values, per diode) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM PARM Tstg Tj dV/dt dPtot * : --------------dTj Parameter Repetitive peak reverse voltage RMS forward voltage TO-220AB / Average forward current D2PAK / I2PAK = 0.5 TO-220FPAB Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage Tc = 155C Per diode Tc = 125C Per device tp = 10ms sinusoidal tp = 2s F = 1kHz square tp = 100ms square tp = 1s Tj = 25C Value 45 30 10 20 180 1 2 4000 -65 to + 175 175 10000 Unit V A A A A A W C C V/s 1 < -------------------------Rth ( j - a ) thermal runaway condition for a diode on its own heatsink Table 4: Thermal Resistance Parameters Symbol Rth(j-c) Rth(c) Junction to case Coupling Parameter TO-220AB / D PAK / I PAK Per diode Total TO-220FPAB Per diode Total TO-220AB / D2PAK / I2PAK Coupling TO-220FPAB 2 2 Value 2.2 1.3 4.5 3.5 0.3 2.5 Unit C/W C/W When the diodes 1 and 2 are used simultaneously: Tj(diode 1) = P(diode 1) x Rth(j-c)(per diode) + P(diode 2) x Rth(c) Table 5: Static Electrical Characteristics (per diode) Symbol IR * Tests conditions Tj = 25C VR = VRRM Reverse leakage current Tj = 125C Tj = 125C VF * Forward voltage drop * tp = 380 s, < 2% Parameter Min. Typ 7 0.5 0.65 Max. 100 15 0.57 0.84 0.72 Unit A mA V IF = 10A IF = 20A Tj = 25C Tj = 125C Pulse test: To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.015 IF (RMS) 2 2/8 STPS2045C Figure 1: Average forward power dissipation versus average forward current (per diode) PF(AV)(W) 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 9 Figure 2: Average forward current versus ambient temperature ( = 0.5, per diode) IF(AV)(A) = 0.05 = 0.1 = 0.2 12 = 0.5 10 8 Rth(j-a)=Rth(j-c) TO-220AB DPAK TO-220FPAB =1 Rth(j-a)=15C/W 6 4 T 2 T IF(AV)(A) =tp/T 10 11 tp 0 =tp/T 12 0 25 tp 50 Tamb(C) 75 100 125 150 175 Figure 3: Normalized avalanche derating versus pulse duration PARM(tp) PARM(1s) 1 power Figure 4: Normalized avalanche derating versus junction temperature PARM(tp) PARM(25C) 1.2 1 power 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(s) 10 100 1000 Tj(C) 0 25 50 75 100 125 150 Figure 5: Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220AB, D2PAK, I2PAK) IM(A) 140 120 Figure 6: Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220FPAB) IM(A) 100 80 100 80 TC=75C 60 TC=75C 60 TC=100C 40 TC=100C IM IM 40 20 0 1E-3 1E-2 1E-1 t TC=125C TC=125C t 20 =0.5 t(s) 0 =0.5 t(s) 1E-2 1E-1 1E+0 1E+0 1E-3 3/8 STPS2045C Figure 7: Relative variation of thermal impedance junction to ambient versus pulse duration (TO-220AB, D2PAK, I2PAK) Zth(j-c)/Rth(j-c) 1.0 1.0 Figure 8: Relative variation of thermal impedance junction to ambient versus pulse duration (TO-220FPAB) Zth(j-c)/Rth(j-c) 0.8 0.8 0.6 = 0.5 0.6 = 0.5 0.4 0.4 T 0.2 = 0.2 = 0.1 Single pulse T 0.2 = 0.2 = 0.1 tp(s) 1E-3 1E-2 0.0 1E-4 =tp/T 1E-1 tp 0.0 1E+0 1E-3 Single pulse tp(s) 1E-2 1E-1 =tp/T 1E+0 tp 1E+1 Figure 9: Reverse leakage current versus reverse voltage applied (typical values, per diode) IR(A) 5E+4 Tj=150C Figure 10: Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25C 1E+4 Tj=125C 1E+3 Tj=100C Tj=75C 500 1E+2 Tj=50C 1E+1 Tj=25C 200 1E+0 VR(V) 1E-1 0 5 10 15 20 25 30 35 40 45 100 1 2 5 VR(V) 10 20 50 Figure 11: Forward voltage drop versus forward current (maximum values, per diode) Figure 12: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35m) (D2PAK) Rth(j-a)(C/W) IFM(A) 100.0 Tj=125C (typical values) 80 70 60 10.0 Tj=125C Tj=25C 50 40 30 1.0 20 10 VFM(V) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 S(cm) 0 0 5 10 15 20 25 30 35 40 4/8 STPS2045C Figure 13: D2PAK Package Mechanical Data DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 2.49 2.69 0.098 0.106 0.03 0.23 0.001 0.009 0.70 0.93 0.027 0.037 1.14 1.70 0.045 0.067 0.45 0.60 0.017 0.024 1.23 1.36 0.048 0.054 8.95 9.35 0.352 0.368 10.00 10.40 0.393 0.409 4.88 5.28 0.192 0.208 15.00 15.85 0.590 0.624 1.27 1.40 0.050 0.055 1.40 1.75 0.055 0.069 2.40 3.20 0.094 0.126 0.40 typ. 0.016 typ. 0 8 0 8 REF. A E L2 C2 D L L3 A1 B2 B G A2 R C M * V2 * FLAT ZONE NO LESS THAN 2mm A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 Figure 14: Foot Print Dimensions (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 5/8 STPS2045C Figure 15: TO-220AB Package Mechanical Data DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 2.40 2.70 0.094 0.106 10 10.40 0.393 0.409 16.4 typ. 0.645 typ. 13 14 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151 REF. A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. H2 Dia L5 C A L7 L6 L2 F2 F1 L9 L4 F G1 G M E D Figure 16: I2PAK Package Mechanical Data DIMENSIONS REF. A A E L2 c2 Millimeters Min. 4.40 2.49 0.70 1.14 1.14 0.45 1.23 8.95 2.40 10.0 13.1 3.48 1.27 Max. 4.60 2.69 0.93 1.70 1.70 0.60 1.36 9.35 2.70 10.4 13.6 3.78 1.40 Inches Min. 0.173 0.098 0.028 0.044 0.044 0.018 0.048 0.352 0.094 0.394 0.516 0.137 0.050 Max. 0.181 0.106 0.037 0.067 0.067 0.024 0.054 0.368 0.106 0.409 0.535 0.149 0.055 A1 b b1 b2 D c c2 D e E L c L1 b2 L b1 b e A1 L1 L2 6/8 STPS2045C Figure 17: TO-220FPAB Package Mechanical Data DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.4 4.6 0.173 0.181 2.5 2.7 0.098 0.106 2.5 2.75 0.098 0.108 0.45 0.70 0.018 0.027 0.75 1 0.030 0.039 1.15 1.70 0.045 0.067 1.15 1.70 0.045 0.067 4.95 5.20 0.195 0.205 2.4 2.7 0.094 0.106 10 10.4 0.393 0.409 16 Typ. 0.63 Typ. 28.6 30.6 1.126 1.205 9.8 10.6 0.386 0.417 2.9 3.6 0.114 0.142 15.9 16.4 0.626 0.646 9.00 9.30 0.354 0.366 3.00 3.20 0.118 0.126 REF. A H B Dia L6 L2 L3 L5 D F1 L4 F2 L7 F G1 G E A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 Dia. Table 6: Ordering Information Ordering type STPS2045CT STPS2045CR STPS2045CFP STPS2045CG STPS2045CG-TR Marking STPS2045CT STPS2045CR STPS2045CFP STPS2045CG STPS2045CG Package TO-220AB I2PAK TO-220FPAB D2PAK Weight 2.23 g 1.49 g 2.0 g 1.48 g Base qty 50 50 50 50 1000 Delivery mode Tube Tube Tube Tube Tape & reel Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 m.N. Maximum torque value: 1.0 m.N. Table 7: Revision History Date 05-Oct-2004 01-Dec-2004 Revision 4F 5 Last update. Figure 16 (I2PAK Package Mechanical Data): references b1 and b2 changed from 1.17mm to 1.70mm. Description of Changes 7/8 STPS2045C Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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